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Revolutionizing Wafer Cleaning: BATCHSPRAY® and SicOzone™ Reduce Chemical Consumption Significantly
The global semiconductor fabs are actively working toward sustainability. Using ozone for cleaning directly supports these efforts in semiconductor manufacturing. Batch spray cleaning with the SicOzone™ process ensures high throughput, low media consumption, and reliable performance. Additionally, spiking technology with ozone achieves cleanliness levels on par with traditional methods.




Significantly Reduce Costs by Eliminating Solvents
Polymer residues from dry etching are a common challenge in semiconductor manufacturing. While this method offers precision and efficiency, it can leave behind contaminants that may disrupt subsequent processes. However, it also presents significant opportunities for resource and cost savings. In this article, discover how to cut costs by eliminating solvents in your cleaning process, while still achieving a 100% polymer removal success rate.

Siconnex wins gold at the 2024 Export Award
With great joy and pride, we announce that Siconnex has won the prestigious 2024 Export Award by Außenwirtschaft Austria in the Handcraft & Trade category. In a highly competitive field, Siconnex stood out among many companies and achieved a remarkable success.

SiC semiconductors: Key technology for efficient and sustainable electronics
Where silicon reaches its physical limits, silicon carbide opens up new possibilities and is therefore increasingly used, especially in power electronics. The properties that optimize the performance of electronic components while also contributing to the environment speak for themselves.






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