perc™

100% polymer removal

perc™ enables simple and flexible polymer removal. Thanks to its unique process flexibility, it is used to remove various types of polymer residues after dry etching processes, such as metal, oxide, silicon, or VIA etching.

Features and benefits

100% polymer removal

perc™ is specifically designed for Post Etch Residue Clean. This innovative application effectively removes several types of polymers with a 100 % success rate.

Suitable for several dry etch processes

perc™ enables easy and flexible polymer removal. Its unique process flexibility makes it suitable for removing various types of polymer residues after dry etching processes, including metal, oxide, silicon, or VIA etching.

Accurate concentration

The perc™ function is based on inline spiking technology. DI water applied with a very small quantity of acid/alkaline-based media is used to clean the wafer surface. Unique spiking and mixing technologies guarantee accurate concentration and flow for each wafer.

Low consumption for a sustainable impact

perc™ fits into everyone’s sustainability program due to its low consumption of DI water and chemical media.

► Adjustable for each polymer
► Flexible parameter adjustment
► Point-of-use media usage
► Stable media concentration
► Open process time
► Single-use media
► Recontamination is avoided
► Solvents are obsolete
► Easy waste treatment
► 4 chamber system available
► 25 W/50 W chamber
► Available for 2“ – 12“ wafers
perc™

Looking into a sustainable future with Siconnex

The innovative spiking technology allows for a minimal amount of acids in the DIW stream, leading to a substantial decrease in acid flow. The perc™ process not only removes polymers but also enables precise control of metal loss in the recipe. This offers several advantages, such as guaranteed polymer removal, reduced metal loss, significant reduction in chemical consumption and water usage, efficient waste treatment, and various other benefits.

Polymer removal
%
Throughput increase
%
Reduction of waste treatment
%
Reduction of chemical consumption
%
Reduction of costs per wafer
%

Compared to conventional cleaning systems

perc™

Designed for Post Etch Residue Clean

perc™ is specifically designed for Post Etch Residue Clean. This innovative application effectively removes several types of polymers with a 100 % success rate.

PERC™

Result: 100% removal of polymers

The perc™ function employs inline spiking technology, utilizing a precise combination of DI water and a minimal amount of acid/alkaline-based media for wafer surface cleaning. Our distinctive spiking and mixing techniques ensure precise concentration and flow control for every individual wafer.

Download perc™ flyer

Sustainability

Green Goals. Yellow Solutions.

Technology is all around us, shaping our daily lives and making them better. Siconnex is redefining progress by merging technology and sustainability, no longer presenting them as opposites. Sustainable technology for the progress of tomorrow. Green Goals. Yellow Solutions.

We are here to listen.