Features and benefits
perc™ is specifically designed for Post Etch Residue Clean. This innovative application effectively removes several types of polymers with a 100 % success rate.
perc™ enables easy and flexible polymer removal. Its unique process flexibility makes it suitable for removing various types of polymer residues after dry etching processes, including metal, oxide, silicon, or VIA etching.
The perc™ function is based on inline spiking technology. DI water applied with a very small quantity of acid/alkaline-based media is used to clean the wafer surface. Unique spiking and mixing technologies guarantee accurate concentration and flow for each wafer.
perc™ fits into everyone’s sustainability program due to its low consumption of DI water and chemical media.
Looking into a sustainable future with Siconnex
The innovative spiking technology allows for a minimal amount of acids in the DIW stream, leading to a substantial decrease in acid flow. The perc™ process not only removes polymers but also enables precise control of metal loss in the recipe. This offers several advantages, such as guaranteed polymer removal, reduced metal loss, significant reduction in chemical consumption and water usage, efficient waste treatment, and various other benefits.
Compared to conventional cleaning systems
Green Goals. Yellow Solutions.
Technology is all around us, shaping our daily lives and making them better. Siconnex is redefining progress by merging technology and sustainability, no longer presenting them as opposites. Sustainable technology for the progress of tomorrow. Green Goals. Yellow Solutions.