Siconnex

Green goals. Yellow solutions.

In today’s industrial landscape, sustainability has become a top priority across various sectors, including semiconductor manufacturing. Companies are increasingly focused on conserving resources and optimizing the use of costly chemicals. Siconnex, a forward-thinking company, foresaw this need for sustainability over two decades ago when it introduced its innovative BATCHSPRAY® technology. With its „yellow solutions“, Siconnex is transforming the industry towards greener production.

Siconnex's products are known for

Low Consumption of Chemicals

 

Huge Water savings

 

Reduction of harmful exhaust gases

 

Reduction of Energy

 

Comparison

BATCHSPRAY® vs. wet bench

Batch spraying emerges as the greener choice, conserving chemicals and water, while reducing waste, and contributing to environmental preservation.

Savings example

Equipment

0%
Reduction of footprint
0%
Reduction of electricity
0%
Reduction of exhaust consumption
0%
Reduction of process media

Compared to conventional wet benches

Savings example

PERC™ Application

Reduction of waste treatment
%
Reduction of Chemical Consumption
%

Compared to conventional cleaning systems

Savings example

SicOzone application

Reduction of chemical consumption
%
Reduction of waste treatment
%

Compared to conventional wet benches

Green developments

Application

SicOzone

SicOzone stands out in the industry with its peerless efficiency in clean and strip applications. Its uniqueness lies in its high efficacy, making it a standout choice to bring sustainability in semiconductor industry.

Application

PERC™

percTM enables simple and flexible polymer removal. Due to its unique process flexibility its used to remove any kind of polymer residues after dry etching processes like metal-, oxide-, silicon- or VIA etching.

Technology

BATCHSPRAY®

BATCHSPRAY®, our core technology used in all our equipment, provides efficient chemical-based cleaning, etching, rinsing, and drying within a versatile process chamber. It can be configured for either one carrier with 25 wafers or two carriers with 50 wafers and can operate up to four chambers simultaneously, delivering throughputs of up to 400 wafers per hour.

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