Unlocking success: Your needs, our solutions.

Unlock your path to success with Siconnex Equipment. Discover how our cutting-edge solutions can cover a wide range of wafer manufacturing processes tailored to your needs.

Etch

Backside Etch

Backside etching is the process of removing microns from the back side of a substrate. The process is often used for thinning materials such as Silicon (Si), Gallium Arsenide (GaAs), Germanium (Ge), and Glass in a wet environment. Maintaining uniformity is critical, with targets of 5% within a wafer, 10% from wafer to wafer, and batch to batch, in terms of „total thickness variation.“ Precise equipment control is essential to manage the exothermic etching reaction and ensure consistent results.

Suitable Equipment

Acid
Acid/Solvent
Etch

Stress Relief

Stress relief is a crucial process deployed to mitigate substrate stress caused by grinding-induced cracks. It involves removing a few microns from the substrate, typically ranging from 5 to 15µm. The objective is to maintain uniformity, with targets of <3% variation within a wafer and <5% from wafer to wafer. Effective equipment control is vital for managing the exothermic reaction associated with this process.

Suitable Equipment

Acid
Acid/Solvent
Clean

SicOzone Clean

Sicozone clean is a versatile solution widely used in chip manufacturing. It serves various purposes, including cleaning organics and metals, as well as performing oxide etches. Applications range from pre-implantation to furnace processses by addressing gate oxides, tunnel oxides, and channel oxides. Additionally, it is deployed in advanced packaging for diced wafers. Standard benchmarks include particle counts below 20 @ 0.12µm, contamination levels below 1E10 for metals, and uniformities less than 1%. Furthermore, it boasts minimal chemical and water consumption while delivering high cleaning efficiency.

Suitable Equipment

Acid
Clean
Acid/Clean
Clean

RCA Clean

RCA Clean is a conventional method used in semiconductor processes for cleaning organics, metals, and performing oxide etches. It meets industry standards with particle counts consistently below 20 @ 0.12µm, minimal metal contamination below 1E10, and uniformities consistently less than 1%. This well-established technique remains effective in chip manufacturing for maintaining cleanliness and performance.

Suitable Equipment

Acid
Acid/Clean

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