BATCHSPRAY®AcidAutoload
General features
Controlled wafer rotation combined with smart chemical spraying results in excellent uniformity.
Intelligent wafer handling meets experienced wafer processing.
A robot transfers the wafer batch from load port into the process chamber.
Thanks to a clever assembly of process modules, we achieve two process chambers.
Small process module footprint combined with smart wafer handling.
Processes for SiC and GaN substrates are available.
Recirculation of the chemical provides a stable temperature and concentration condition.
Optional automation features
For enhanced wafer handling efficiency, we offer dedicated handlers specifically designed for dirty in/clean out processes. These specialized handlers ensure optimal cleanliness and prevent cross-contamination, maintaining the highest standards of wafer integrity.
To capture your unique process requirements, our equipment includes dedicated handlers for both left and right process chambers. This tailored approach maximizes workflow flexibility, enabling seamless integration into your existing setup for improved productivity and convenience.
Wafer size
Wafer materials
Feasible processes
Suitable features
Countable benefits
This two-chamber system provides excellent etching uniformity together with chemical savings and features all types of wet etch processes. Highly precise in-tank chemical mixing, end point detection (EPD) and the patented Retainer Comb Handling system are included. In addition, the SicOzone resist strip can be applied within the same chamber, which allows for greater flexibility and fewer handling steps.
*Compared to conventional processes
SicOzone Clean
The smart usage of ozone combined with flexible amounts of ammonia, hydrochloric-, hydrofluoric acid and water enables outstanding cleaning performance. A minimum DI water flow applied and sprayed onto the wafers by spiking tiny amounts of ammonia combined with ozone allow for replication of a traditional SC1 step. Similar for SC1 and DHF, the cleaning efficiency can easily be controlled by the high flexibility provided with our inline spiking technology.
End Point Detection
The Siconnex End Point Detection is a system for controlling the etching process by an optical reflection of the etched metal. This system decreases chemical consumption and provides excellent process control and repeatability for metal etching.
Green Goals. Yellow Solutions.
Technology is all around us, shaping our daily lives and making them better. Siconnex is redefining progress by merging technology and sustainability, no longer presenting them as opposites. Sustainable technology for the progress of tomorrow. Green Goals. Yellow Solutions.