BATCHSPRAY®Acid/CleanAutoload
General features
Controlled wafer rotation combined with smart chemical spray gain leads to excellent uniformity.
Intelligent wafer handling meets experienced wafer processing.
A robot tranfers the wafer batch from loadport into the process chamber.
Thanks to a clever assembly of process modules, we achieve three process chambers.
Small process module footprint combined with smart wafer handling.
Only for acid applications
Recirculation of the chemical provides a stable temperature and concentration condition. Only for acid applications.
Optional automation features
For enhanced wafer handling efficiency, we offer dedicated handlers specifically designed for dirty in/clean out processes. These specialized handlers ensure optimal cleanliness and prevent cross-contamination, maintaining the highest standards of wafer integrity.
To capture your unique process requirements, our equipment includes dedicated handlers for both left and right process chambers. This tailored approach maximizes workflow flexibility, enabling seamless integration into your existing setup for improved productivity and convenience.
Wafer size
Wafer materials
Feasible applications
Suitable features
Countable benefits
This three-chamber system features all types of wet etch processes together with clean applications using the patented Retainer Comb Handling system. The acid/clean combination leads to high process flexibility and increased throughput. With sustainable processes like cleaning or resist stripping using SicOzone instead of peroxide and sulfuric acid, savings of up to 90% in the consumption of chemicals and DI water can be achieved.
*Compared to conventional processes
Green Goals. Yellow Solutions.
Technology is all around us, shaping our daily lives and making them better. Siconnex is redefining progress by merging technology and sustainability, no longer presenting them as opposites. Sustainable technology for the progress of tomorrow. Green Goals. Yellow Solutions.