Wafer processing

Discover how our cutting-edge systems can cover a wide range of wafer manufacturing processes tailored to the needs of semiconductor industry.

Front End of Line - FEOL

Siconnex offers a wide range of semiconductor equipment for FEOL, which marks the initial stage in IC manufacturing, shaping transistors, capacitors, and resistors within the semiconductor, concluding before the metal interconnect layers are deposited.

Back End of Line - BEOL

BEOL, the second phase of IC manufacturing, interconnects devices with metal wiring. It commences with the initial metal layer deposition. Siconnex provides an excellent and comprehensive range of semiconductor equipment for all these process steps.

Wafer packaging

Elevate your wafer packaging process with our comprehensive semiconductor equipment solutions. From start to finish, we’ve got you covered, ensuring efficiency, precision and competitiveness at every fabrication step.