BATCHSPRAY®Solvent
General features
Intelligent wafer handling meets experienced wafer processing.
Once the batch is transferred to the chamber, the process flow is automated through several process steps.
Small process module footprint combined with smart wafer handling.
Processes for SiC and GaN substrates are available.
Recirculation of the chemical provides a stable temperature and concentration condition.
Extractable process chamber for easy servicing.
Wafer size
Wafer materials
Feasible applications
Suitable features
Green Goals. Yellow Solutions.
Technology is all around us, shaping our daily lives and making them better. Siconnex is redefining progress by merging technology and sustainability, no longer presenting them as opposites. Sustainable technology for the progress of tomorrow. Green Goals. Yellow Solutions.
FAQs
The tank size is 20 liters.
For the drying process, we inject hot nitrogen into the chamber while spinning the wafers at very high speeds.
Inline heaters are used to heat the chemicals.
10-inch filters can be used.
By enabling CO2, it is injected into the DIW flow to prevent corrosion of metals.