Siconnex Rebrands Core Product to BATCHSPRAY® Four
Siconnex, a global leader in batch spray processing technology for the semiconductor industry, has rebranded one of its core products: the tool formerly known as BATCHSPRAY® Autoload CLEAN is now marketed as BATCHSPRAY® Four, aligning the name with the system’s full capabilities and strategic positioning, and will be showcased at SEMICON Europa 2025 in Munich this November.
The change was driven by direct customer feedback, which revealed that the previous name led to a limited perception of the tool as solely for cleaning. In reality, the system offers advanced functionality, including resist stripping, polymer removal, and cost-efficient RCA clean replacement.
“Customers often assumed CLEAN was just a cleaning tool,” said Fabio Wörndl co-CEO & CMO at Siconnex. “With four independent chambers and a broad application range, the new name FOUR better reflects its versatility.”
BATCHSPRAY® Four – Cost Saving Meets Sustainability
The BATCHSPRAY® Four delivers a high throughput of up to 500 wafers per hour, while reducing chemical and DI water use by up to 90% – translating to a footprint efficiency of 38.3 wafers/hour/m².
Its flexibility supports both FEOL and BEOL applications, simplifying fab operations by reducing the need for multiple process-specific tools.
The new name highlights the tool’s four-chamber configuration, key to enabling high throughput and process adaptability in a compact footprint.
Siconnex will showcase the BATCHSPRAY® Four at SEMICON Europa 2025 in Munich this November.