Fraunhofer IZM Berlin Modernizes Wafer Cleaning with Siconnex BATCHSPRAY® Acid
The Fraunhofer Institute for Reliability and Microintegration IZM in Berlin has successfully commissioned a Siconnex BATCHSPRAY® Acid system. Following successful hook-up and tool qualification, the institute is leaving manual wet bench cleaning behind, shifting to a fully automated, closed-system solution. This marks a crucial step in standardizing processes within the new APECS pilot line—the institute’s state-of-the-art development center for advanced packaging.
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Process Stability and Safety for Advanced Packaging
Transitioning to Siconnex BATCHSPRAY® technology eliminates the typical variables associated with manual cleaning steps, such as fluctuating immersion times, chemical concentration deviations, and the general risk of handling errors.
The closed operating concept takes operator safety to the next level while drastically reducing chemical consumption and process times—directly improving Cost of Ownership (CoO).
Extreme process flexibility is critical, especially for research institutions and R&D departments. The system meets this demand perfectly: It processes both planar and patterned wafers of various sizes and materials with maximum resource efficiency. It consistently delivers highly reproducible surface conditions, creating the ideal starting point for critical subsequent processes like oxidation or wafer bonding.
Fraunhofer IZM confirms exactly this practical capability:
„The Siconnex BATCHSPRAY® Acid has been integrated into Fraunhofer IZM’s APECS pilot line to support standardized wafer cleaning processes. Its flexibility in handling different wafer types and sizes broadens the range of applications that can be addressed within the cleanroom environment. Together with its compact design, reduced media consumption and closed operating concept, the system provides reliable process conditions for applied research, process development and technology transfer.“
Foto: © Fraunhofer IZM | Francis Viebeck