First Tool Move-In in Itzehoe: Siconnex Leads the Way at Vishay’s New 300mm Mega-Fab

Moving sensitive equipment is an exercise in high-stakes precision, and in Itzehoe, the process was perfectly choreographed. Once the trucks arrived, crews transferred the units into the initial staging bays to carefully strip away the wooden transport shells and climate-controlled packaging. The critical phase followed: lifting the tools via freight elevator directly to the cleanroom level. Using spezialized equipment, the Siconnex equipment were guided out of the lift with inch-perfect accuracy and set into their final footprints. This successful landing marks the physical kickoff for equipping Vishay’s new 300mm fab.

300mm: More Than Just Scale

Vishay is standing up a fully automated production line dedicated to automotive MOSFETs – the very power semiconductors that serve as the fundamental enablers of modern electromobility. By taking this strategic step in Europe, Vishay is sending a decisive signal regarding supply security for the European automotive sector. In an era where „supply chain sovereignty“ has become the defining priority, this expansion is set to create approximately 150 new jobs at the facility.

First Choice: Why Siconnex Led the Way

The fact that the Austrian-made equipment were the first to roll through the door was no logistical accident; it was the result of a clear prioritization by Vishay. “Our engineers selected Siconnex first, and they were the first to sign contracts,” explains Otto Graf, the lead manager on-site for Vishay. In the complex world of 300mm manufacturing, reliability and early alignment are paramount.

BATCHSPRAY^®: Answering Industry Challenges

For Fabio Wörndl, Co-CEO & CMO of Siconnex, this early move-in is more than just a logistical milestone: “It is a tremendous honor to be the first equipment manufacturer to bring systems into this state-of-the-art 300mm fab in Itzehoe.”

The systems, custom-tailored for Vishay, are specifically configured for metallic etching (AlCu) and post-dry-etch polymer removal. Siconnex secured this position primarily due to the advantages of its BATCHSPRAY^® technology, which delivers in three critical areas:

• Footprint Efficiency: With cleanroom real estate in a 300mm fab commanding a premium, the compact design of Siconnex tools provides a strategic advantage, maximizing output-per-square-meter.
• Resource Management: Unlike traditional wet benches, BATCHSPRAY^® technology is significantly more resource-efficient. By utilizing targeted centrifugal spraying and advanced recirculation systems, chemical and water consumption are drastically reduced.
• Automation & Safety: In a fully automated 300mm environment, manual handling is no longer an option. Full integration into the fab’s automation suite increases throughput while eliminating human error.

Fabio Wörndl summarizes: “At the end of the day, semiconductor manufacturers are looking for ways to reduce complexity while boosting efficiency. Our BATCHSPRAY^® solutions provide exactly that answer to the industry’s current challenges.”

The „Hook-up“ Phase Begins

With the first tools in position, the facility teams now take center stage for the „hook-up“ – connecting the systems to the fab’s specialized utilities and ramping up the processes. The schedule is aggressive, as is the norm in this industry. According to Otto Graf, the goal is to have the first engineering samples running through the line—fully automated—by early summer. At that point, Vishay will have officially opened a new chapter in European semiconductor manufacturing.