General features

Non-uniformity <1%

Controlled wafer rotation combined with smart chemical spraying results in excellent uniformity.

Throughput up to 300 wph

Intelligent wafer handling meets experienced wafer processing.

Fully automated

A robot transfers the wafer batch from load port into the process chamber.

2 process chambers

Thanks to a clever assembly of process modules, we achieve two process chambers.

Footprint <12 m²

Small process module footprint combined with smart wafer handling.

Processes on SiC/GaN

Processes for SiC and GaN substrates are available.

Chemical recirculation by tank system

Recirculation of the chemical provides a stable temperature and concentration condition.

Optional automation features

Dedicated handlers for dirty in/clean out handling

For enhanced wafer handling efficiency, we offer dedicated handlers specifically designed for dirty in/clean out processes. These specialized handlers ensure optimal cleanliness and prevent cross-contamination, maintaining the highest standards of wafer integrity.

Dedicated handlers for left and right process chamber

To capture your unique process requirements, our equipment includes dedicated handlers for both left and right process chambers. This tailored approach maximizes workflow flexibility, enabling seamless integration into your existing setup for improved productivity and convenience.

DNA of our equipment

BATCHSPRAY® Technology

BATCHSPRAY®, our core technology of all our wet chemistry equipment, offers efficient chemical-based cleaning, etching, rinsing, and drying within a versatile process chamber. It accommodates one carrier with 25 wafers or two carriers with 50 wafers and can run up to four chambers simultaneously, achieving throughputs of up to 600 wafers per hour.

Wafer size

Wafer materials

Feasible processes

Resist Strip

Suitable features

End Point Detection
BATCHSPRAY® Acid Autoload 300 mm

Countable benefits

This two-chamber system provides excellent etching uniformity together with chemical savings and features all types of wet etch processes. Highly precise in-tank chemical mixing, end point detection (EPD) and the patented Retainer Comb Handling system are included. In addition, the SicOzone resist strip can be applied within the same chamber, which allows for greater flexibility and fewer handling steps.

Cost per wafer savings
Throughput increase
Reduction of footprint

*Compared to conventional processes

Green Goals. Yellow Solutions.

Technology is all around us, shaping our daily lives and making them better. Siconnex is redefining progress by merging technology and sustainability, no longer presenting them as opposites. Sustainable technology for the progress of tomorrow. Green Goals. Yellow Solutions.