Why do we build such high-quality equipment? Because WE CAN.

The Siconnex BATCHSPRAY® Technology

Our innovative BATCHSPRAY® technology is based on a closed system, in which chemical-based cleaning and etching processes are performed highly efficiently. Various chemical processes, including rinsing and drying, are performed fully automatically in a process chamber. The process chamber can be designed for one carrier with 25 wafers or two carriers with 50 wafers to suit your needs. Thanks to our autoload equipment, up to four chambers can be loaded simultaneously to enable throughputs of up to 400 wafers per hour.

Our customers‘ profits are maximised by the lower equipment footprint, process media and staff costs, while safety is considerably increased. All the applications are tested at our in-house Siconnex laboratory in Salzburg, Austria.

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BATCHSPRAY®

guarantees top quality, while also conserving key resources

Several nozzles and rotation of the wafers during the process ensure an absolutely uniform spray pattern of chemicals on the wafers and uniformity within one percent. In addition, our Siconnex BATCHSPRAY® technology cuts the relevant total operating costs by up to 80 percent in comparison with wet benches.

Why BATCHSPRAY®?

Our BATCHSPRAY® equipment makes the production of a wide range of products more efficient. In particular, it enables:

  • Reduced use of chemicals and process media
  • Enhanced product quality
  • Minimisation of waste
  • Improved user safety
  • Reduction in the required clean-room space

The ability to combine up to five processes provides incredible potential for increased efficiency and optimisation, even in the case of short production runs.

Why BATCHSPRAY<sup>®</sup>?

Processes

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Etch

  • Metal Etch (Al, Cu, Ti, Au, Ni,…) with End Point Detection
  • III/V Etch (GaAs, AlGaAs, InGaP,…)
  • Oxide Etch
  • Freckle Etch
  • Silicon Stress Relief
  • Ge Etch
  • Nitride Etch
  • UBM Etch
  • Glass Etch

Clean

  • SicOzoneTM Clean
  • SicOzoneTM + Ultra Diluted Clean Applications
  • Contact Cleans
  • Organic Removal & Clean
  • Etch Residue Clean
  • Post Ash Residue Clean
  • HF Last
  • Prediffusion Cleans
  • Field Cleans (Organic & Inorganic Cleans)
  • Ge Clean

Resist Strip

  • SicOzoneTM Strip
  • Positive and Negative Resist Strip
  • Implanted Photo Resist Strip
  • Enhanced Resist Strip
  • Resist Rework
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Clean

  • Polymer Clean
  • Etch Residue Clean
  • Post Ash Residue Clean

Resist Strip

  • Positive Resist Strip
  • Negative Resist Strip

Resist Developing

  • Photoresist Developing
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Etch

  • Metal Etch (Al, Cu, Ti, Au, Ni,…) with End Point Detection
  • III/V Etch (GaAs, AlGaAs, InGaP,…)
  • Oxide Etch
  • Freckle Etch
  • Silicon Stress Relief
  • Ge Etch
  • Nitride Etch
  • UBM Etch
  • Glass Etch

Clean

  • SicOzoneTM Clean
  • SicOzoneTM + Ultra Diluted Clean Applications
  • Contact Cleans
  • Organic Removal & Clean
  • HF Last
  • Prediffusion Cleans
  • Field Cleans (Organic & Inorganic Cleans)
  • Polymer Clean
  • Etch Residue Clean
  • Post Ash Residue Clean
  • Ge Clean

Resist Strip

  • SicOzoneTM Strip
  • Positive and Negative Resist Strip
  • Implanted Photo Resist Strip
  • Enhanced Resist Strip
  • Resist Rework
  • Positive Resist Strip
  • Negative Resist Strip

Resist Developing

  • Photoresist Developing

Applications

Power

Power semiconductors are used to operate and control motors and to generate energy. For example, they are required in motor vehicles, electric engines, robots, amplifiers, photovoltaic systems and power plants.

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Applications

  • Al Etch
  • Freckle Etch
  • Oxide Etch
  • Solvent Resist Strip
  • O3 Resist Strip
  • Ti Etch
  • Si/PolySi Etch
  • Ag Etch
  • Ni Etch
  • Cu Etch
  • Pt/PtSi Etch
  • Solvent Clean
  • HF/Glas Etch
  • SPM
  • WEtch
  • TiN Etch
  • TiW
  • Pd Etch
  • Solvent Resist
  • Development
  • Post Etch Clean
  • SC1
  • SC2
  • HF Clean

Products

  • Diodes
  • Bipolar transistors
  • IGBT
  • JFET
  • MOSFET
  • GTO
  • Thyristors

Analog/Mixed Signal

The role of this type of semiconductor is to receive, process and send signals, primarily in smartphones and smartwatches, Wi-Fi, GPS and all products used for communication.

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Applications

  • Solvent Resist Strip
  • Solvent Polymer Removal/Clean
  • Au Etch
  • Al Etch
  • Cu Etch
  • SicOzoneTM Clean
  • Ni Etch
  • Ti Etch
  • TiN Etch
  • TiW
  • Freckle Etch
  • Oxide Etch
  • O3 Resist Strip
  • SPM
  • Resist Development
  • Poly Si Etch
  • AlSiCu Etch
  • Mo Etch
  • Ag Etch
  • Cr Etch
  • TiW Etch
  • NiV Etch

Products

  • Filters
  • Antennae
  • Receivers

LED

LED semiconductors have become an integral component in the lighting sector and are needed for car headlights, lasers, electronic devices and all LED lights.

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Applications

  • GaN Etch
  • SicOzoneTM Clean
  • Au Etch
  • Oxide Etch
  • Al Etch
  • GaAs Etch
  • Ti Etch
  • TiW Etch
  • Solvent Resist Strip
  • SPM
  • SC1 Clean

Products

  • Lighting
  • Lasers

MEMS

MEMS (micro electromechanical systems) are predominantly found in sensors, sometimes in actuators and occasionally in mechanical components such as springs. They are used in smartphones and games consoles, televisions and smartwatches, robots and cars.

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Applications

  • O3 Resist Strip
  • SC1
  • Solvent (EKC, NMP)
  • SPM
  • SC2
  • Al Etch
  • Oxide Etch
  • HF Etch
  • Post Ash Clean
  • TiW Etch
  • Pd Etch

Products

  • Acceleration sensors
  • Gyroscopes
  • Magnetometers
  • Pressure sensors
  • Photosensors
  • Infrared sensors
  • Radiation sensors

Special Markets

In very specialised areas, it is extremely important for equipment to be versatile. The ability of our BATCHSPRAY® equipment to combine up to five different processes provides incredible potential for increased efficiency and optimisation, even in the case of short production runs. This allows our global customers to mass-produce their products and make them competitive in special markets.

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Siconnex Worldwide

Siconnex Austria

Siconnex customized solutions GmbH
Gewerbestrasse 2
5322 Hof bei Salzburg
Tel: +43 6229 36 646-0
Fax: +43 6229 36 646-146
Email: office@siconnex.com

Siconnex France

83 Rue roger du Marais
38430 Moirans
Tel: +33 631 30 55 54
Email: france@siconnex.com

Siconnex Malaysia

Siconnex Malaysia Sdn. Bhd.
No 1-04-15 e-Gate
Lebuh Tunku Kudin 2

11700 Gelugor Penang
Tel: +6 012 4256568
Email: malaysia@siconnex.com

Siconnex America

Siconnex America Inc.
3010 LBJ Freeway Suite 1200
75234 Dallas, Texas
Tel: +1 214 710 2469
Email: america@siconnex.com

Siconnex Singapore

Siconnex Singapore Pte. Ltd.
4 Battery Road
Bank of China Building #25-01

049908 Singapore
Tel: +65 838 88977
Email: singapore@siconnex.com

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