Our innovative BATCHSPRAY® technology is based on a closed system, in which chemical-based cleaning and etching processes are performed highly efficiently. Various chemical processes, including rinsing and drying, are performed fully automatically in a process chamber. The process chamber can be designed for one carrier with 25 wafers or two carriers with 50 wafers to suit your needs. Thanks to our autoload equipment, up to four chambers can be loaded simultaneously to enable throughputs of up to 400 wafers per hour.

Our customers‘ profits are maximised by the lower equipment footprint, process media and staff costs, while safety is considerably increased. All the applications are tested at our in-house Siconnex laboratory in Salzburg, Austria.

perc™enables simple and flexible polymer removal. Due to its unique process flexibility it is used to remove any kind of polymer residues after dry etching processes like metal-, oxide-, silicon- or VIA etching.

The perc™ function is based on inline spiking technology. DI water applied with a very small quantity of acid/alkaline-based media is used to clean the wafer surface. Unique spiking and mixing technologies guarantee accurate concentration and flow for each wafer.

SicOzone enables the achievement of superior results in cleaning and stripping within the semiconductor manufacturing industry. On one hand, the intelligent utilization of ozone in conjunction with variable amounts of ammonia, hydrochloric acid, hydrofluoric acid, and water ensures outstanding cleaning performance. On the other hand, the photoresist stripping process harnesses ozone to promote sustainable resource usage. This process involves combining DI water with ozone in gas form to effectively remove photoresist from the wafer surface.