Redefining batch spray
Siconnex rethinks batch spray methodology, enabling semiconductor manufacturers to achieve high throughput and process results on single wafer level. Our innovative technology ensures that wafers rotate on their own axis, maintaining a uniform spray pattern. This efficiency allows our customers to minimize process media and labor costs while significantly increasing throughput and profitability.
Why BATCHSPRAY®?
We have significantly reduced our consumption of chemicals and process media, contributing to a greener and more environmentally friendly approach.
Improved semiconductor product quality with advanced technologies, boosting performance and reliability.
Our company specializes in innovative batch spray solutions for the minimization of waste, promoting sustainability at every step.
Through cutting-edge advancements, we prioritize enhancing user safety, ensuring a secure and reliable handling.
With our equipment, we achieve a significant reduction in the required clean-room space for our customers, ensuring higher productivity per square meter.
Guarantees quality & saves resources
Multiple nozzles and wafer rotation ensure a consistent one percent uniform spray pattern of chemicals. Siconnex BATCHSPRAY® technology reduces total operating costs by up to 80% compared to wet benches.
*Compared to conventional wet benches
Videos
Uniform spray pattern