General Information
General Information about Spray Solvent Tool
Process Principle
Chemicals are sprayed on the spinning Substrates, then the batch is rinsed with demineralized and hot demineralized water and dried with hot nitrogen.
Application
Dissolve off any layer of a whole batch of wafers at once.
Clean and dry the wafers.
Processes Examples
- Polymere removal (post etch residue)
- Photo resist stripping
- Metal lift-off
- and many more...
Advantages
- Reliable Hardware
- Siconnex Focus
- Components
- Operator Safety: Automated Dry-to-Dry Process
- Environmental friendly, less DIW & Exhaust Consumption
- Fast Support
- Fully trained Field Service Engineer
- Software & Service Support
- Spare parts on stock
- Process Knowledge
- Process Development
- Reliable
- Process Support
- Customized Process Hardware




