
- Automated
- Dry to Dry
- Batch Spray System
| Main Applications - Metal Etch
- Oxide Etch
- Ti-Etch
- Tungsten Etch
- PDC (DHF, SC1, SC2)
- Resist Strip
- Freckle Etch
Process Example - (1) Load Wafer
- (2) Al-Etch
- (3) DIW Rinse
- (4) Freckle Etch
- (5) DIW Rinse
- (6) Resist Strip
- (7) DIW Rinse
- (8) Dry Wafer
Advantages - Operator Safety
- Closed automated System
- Uniformities <3%
- DIW Savings
- End Point Detection
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