Hazardous wet chemical cleaning and etching tasks are performed safely and efficiently within a completely closed system. All processes from chemical to final rinsing and drying are fully automated, ensuring repeatable processes and uniformities even below 1%. Our Batch Wafer Spray systems support a wide range of applications from mass production to R&D and prototyping.

The process chemicals are stored and heated/ cooled in a closed compartment. The chemicals are sprayed into a closed process chamber via pump and filter. Various nozzles ensure a uniform spray pattern. Wafers rotate during chemical spraying to ensure best results with regard to uniformity. The chemicals can either be recirculated or used one time only.

The process chamber houses either 1 carrier with 25 wafers or 2 carriers of up to 50 wafers. This BATCH WAFER SPRAY technology reduces the relevant cost of ownership figures by 80% compared with a wet bench.