Siconnex - Batch Spray and Single Wafer Equipment

Spare Parts & Services

2010-06-21T11:50:19

Siconnex

Spray Acid Tool (SAT 200)
Spray Solvent Tool (SST 200)
Single Wafer (VERTICAL 200)

Service and process engineers in Austria and Asia.
Process laboratory in Austria

All spare parts come with warranty
Express shipment within 24 hours available
Warehouse depot for spare parts & consumables in Europe and in Asia

Contact

office@siconnex.com
Phone: +43 6229 36646-0
Fax: +43 6229 36646-146

Technical Information

2010-04-20T16:15:52

Chemical Layout


Process Chamber 25/50 Wafer	Process Rotor 25/50 Wafer

Process Example

2010-04-20T11:33:42

Process Example

(1) Load Wafer
(2) 2:30 min Al-Etch
(3) 1:30 min DIW Rinse
(4) 1:30 min Freckle Etch
(5) 1:30 min DIW Rinse
(6) 9:00 min Resist Strip
(7) 6:00 min DIW Rinse
(8) 9:00 min Dry Wafer

Total: 31 min
~ 98wafer/h Dry to Dry

APPLICATIONS

Cleaning

Polymere removal
Pre Diffusion Clean (DHF, SC1, SC2)
Wafer Reclaim
Post CMP Clean
Monitor Wafer Clean

Etch

Metal Etch (Al, Pt, Ti, TiW, Au, Cu,....)
Oxide Etch
Si-Etch
Freckle Etch

Resist Strip

Positive Resist
Negative Resist
SicOzone� Resist Strip

Process Rotor & Inserts for SAT 200

2010-04-20T09:32:47

Solution 1: Standard Rotor for one substrate size


Solution 2: Standard Rotor and Insert Solution for multiple substrate sizes


Solution 3: Master Rotor and Clamshell Insert Solution for multiple substrate sizes

Process Rotor & Inserts for SST 200

2010-04-20T09:01:02

Solution 1: Standard Stainless Steel Rotor for one substrate size


Solution 2: Stainless Steel Rotor and Insert Solution for multiple substrate sizes


Solution 3: Stainless Steel Master Rotor and Insert Solution for multiple substrate sizes (2"-8")

Applications

2010-04-20T08:44:11

Process Principle

Dry to Dry
Automated
Batch Spray

Advantages

Operator Safety
Equipment with Small Footprint
Low DI Water Consumption

Etch

Metal Etch (Al, Pt, Ti, TiW, Au, Cu,....)
Oxide Etch
Si-Etch
Freckle Etch

Cleaning

Polymer removal (Acid)
Pre Diffusion Clean (DHF, SC1, SC2)
Wafer Reclaim
Post CMP Clean
Monitor Wafer Clean
Polymer removal (Solvent)

Resist Strip (Acids, O3)

Positive Resist
Negative Resist
SicOzone� Resist Strip

Resist Strip (Solvents)

Positive Resist
Negative Resist

Develop

Batch Delevop

Process Example

Load Wafer
Step 1: Metal Etch
Step 2: Di Water Rinse
Step 3: Freckle Etch
Step 4: Di Water Rinse
Step 5: Resist Strip
Step 6: Di Water Rinse
Step 7: Dry Wafer
more

CD Uniformities

Batch < 3%
Wafer < 3%

Link to Single Wafer Applications

Applications

2010-03-30T18:54:07

Lift Off

Metal Lift Off (Gold or Aluminium)

Resist Strip

with SicOzone Strip (O3)
with Acids
with Solvents

Scrubber

JetSpray
AtomizedSpray
MegaSonic
with NH4OH or HF

Lithography

Resist Coating
Resist Developing
Inline

Watch Euipment Video

Link to Batch Spray Applications

Link to Process Laboratory

Spray Solvent Tool

2010-01-08T09:36:35

Process:

Automated
Dry to Dry
Batch Spray System

Main Applications

Positive Resist Strip
Polymere Removal
Negative Resist Strip
Batch Develop

Advantages

Operator Safety
Closed automated System
Fresh and Used Process Chemicals

Process Example

(1) Load Wafer
(2a) Strip (Solvent used)
(2b) Strip (Solvent fresh)
(3a) Clean (IPA used)
(3b) Clean (IPA fresh)
(4) DIW Rinse
(5) Dry Wafer

Spray Acid Tool

2010-01-08T09:28:10

Automated
Dry to Dry
Batch Spray System

Main Applications

Metal Etch
Oxide Etch
Ti-Etch
Tungsten Etch
PDC (DHF, SC1, SC2)
Resist Strip
Freckle Etch

Process Example

(1) Load Wafer
(2) Al-Etch
(3) DIW Rinse
(4) Freckle Etch
(5) DIW Rinse
(6) Resist Strip
(7) DIW Rinse
(8) Dry Wafer

Advantages

Operator Safety
Closed automated System
Uniformities <3%
DIW Savings
End Point Detection

Technical Information

2008-10-03T11:14:15

Software

Secs II Gem
Acces for 3 Levels (Service, Process, Operator)
Siemens Controller
Siemens Color Touchscreen
99 Recipes
Resistivity Measurement

Wafer Handling & Process

Substrate Sizes 1" to 8"
RPM up to 2500
DI Water Resistivity Sensor
N2 Filter POU

User Interface

Safety

Fire resistant Cover (Takiron, FRPP), according FM4910
CE Certification
Mechanical Door Lock
Emergency Power Off Box (EPO)

Hardware Standards

DI Water Manifold Gasket
DI-W Recirculation
Rear Bowl Seal
N2 Manifold
N2 Pressure Sensors
N2 cartridge heater
Front panel indicator lights
Teflon valve assembly
Cartridge Ferro fluid Seal
High flow, low pressure nozzles
Bowl blanket heater w/ OT thermal switch
Bowl blankets with OT and AT temp thermal switch
Teflon drain tube
Teflon supply lines (3/8� OD)
Colour coded tubing
Nylon barbed pneumatic fittings
Chemical resistant Start/Stop switches
Vibration dampeners
Electropolished Bowl
Brushless Motor
Rotor Stop Positioner (RSP)

Technical Information

2008-10-03T10:47:15

Chemical Layout

Rotor & Inserts

2008-10-03T08:59:32

Change Substrate Size within seconds

Solution 1: Rotor for 8", Insert for 6"


Solution 2: Insert for 8", 6", 5"

Spin Rinse Dryer

2008-10-01T13:54:26

Application

DI Water Rinse
Dry

Principle

Automated
Dry to Dry
Batch Spray System

Spray Ozone Tool

2008-10-01T13:34:14

Automated
Dry to Dry
Batch Spray System

Main Applications

Metal Etch
Oxide Etch
PDC (DHF, SC1, SC2)
Resist Strip
Freckle Etch

Process Example

(1) Load Wafer
(2) Al-Etch
(3) DIW Rinse
(4) Freckle Etch
(5) DIW Rinse
(6) Resist Strip
(7) DIW Rinse
(8) Dry Wafer

Advantages

Operator Safety
Closed automated System
Uniformities <3%
DIW Savings
End Point Detection

DNS Track Systems

2007-08-13T11:25:07

Siconnex offers 3 types of lithography tools:

Coaters: coat wafers (i-line and DUV resist, PIQ, BCB, SOG, SOD)
Developers: develop exposed wafers
In-line Tools: coat/developer interfaced to stepper/scanner