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BATCHSPRAY Autoload

Bridging from 200mm to 300mm, or from manual-load to automation is achievable by adding The BATCHSPRAY Autoload system. This provides a fully integrated 300mm FOUP to FOUP or 200mm Cassette to Cassette automation system for all our different process solutions. The BATCHSPRAY Autoload system can include the flexibility of up to 4 process chambers, with an achievable process throughput of up to 400 wafers per hour. A maximum of 200 wafers can be processed at once, as each chamber can hold up to 50 wafers. All this is possible on a footprint of less than 8m².

ADVANTAGES

  • Dry in - dry out process
  • SMIF, FOUP and standard
    carrier compatible
  • Throughput of up to 400 wph
  • Footprint < 9m²
  • Fully automated
    roboter loading
  • Flush mounting possible
    due to fully enclosed design

 

APPLICATIONS

  • ETCH
  • CLEAN
  • RESIST STRIP

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