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BATCH WAFER SPRAY

Hazardous wet chemical cleaning and etching tasks are performed safely and efficiently within a completely closed system. All processes from chemical to final rinsing and drying are fully automated, ensuring repeatable processes and uniformities even below 1%. Our Batch Wafer Spray systems support a wide range of applications from mass production to R&D and prototyping.



SINGLE WAFER SPRAY

Single Wafer technology is used whenever the complexity of processing requires features like Back- or Frontside Protection, High Pressure Spray or Megasonic Clean. With a maximum of six chambers (2x3 – stacked chamber design) the VERTICAL 200 platform achieves a throughput of up to 140 wafers per hour. The closed chamber design with unique substrate face-down operation eliminates the risk of wafer contamination. Even with an integrated chemical supply and conditioning system, the footprint is still below 4m².