Siconnex develops Metal Lift-Off Process on Single Wafer system (VERTICAL 200 Platform)

The VERTICAL 200 SOLVENT system has been installed in the Siconnex Process laboratory since June 2011. This equipment is capable of running solvent processes like Polymer Removal, Resist Strip and Metal Lift-Off. Over 50,000 customer wafers have been processed on this platform in the Siconnex Laboratory in Salzburg since June.

The first system has already been sold and will be delivered to a German customer in mid November 2011. Throughput: 105 wafers/hour.