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1: Site Map.
2: Contact.

Navigation:

1: HOME
2: SINGLE WAFER
- 2.1: Applications.
- 2.2: Coater, Developer.
- 2.3: Metal Lift Off (MLO).
- 2.4: Scrubber.
- 2.5: Watch Equipment VIDEO.
- 2.6: Training and Support.
3: BATCH SPRAY
- 3.1: Applications.
- 3.2: Spray Acid Tool
  - 3.2.1: Technical Information.
  - 3.2.2: Process Example.
  - 3.2.3: Process Rotor & Inserts for SAT 200.
  - 3.2.4: Watch Equipment Video.
  .
- 3.3: Spray Solvent Tool
  - 3.3.1: Technical Information.
  - 3.3.2: Process Rotor & Inserts for SST 200.
  .
- 3.4: Training and Support.
4: LABORATORY
5: SPARE PARTS & SERVICES
6: COMPANY
- 6.1: Global Locations.
- 6.2: Mission & Roadmap.
- 6.3: Process Laboratory.
- 6.4: Contact
  - 6.4.1: Map.
  - 6.4.2: Online-Contact Form.
  .
- 6.5: Job Opportunities.
- 6.6: Principles.
- 6.7: Legal Information.

1: Applications.
2: Spray Acid Tool
- 2.1: Technical Information.
- 2.2: Process Example.
- 2.3: Process Rotor & Inserts for SAT 200.
- 2.4: Watch Equipment Video.
.
3: Spray Solvent Tool.
4: Training and Support.

Content:

Process Example

R

Process Example

(1) Load Wafer
(2) 2:30 min Al-Etch
(3) 1:30 min DIW Rinse
(4) 1:30 min Freckle Etch
(5) 1:30 min DIW Rinse
(6) 9:00 min Resist Strip
(7) 6:00 min DIW Rinse
(8) 9:00 min Dry Wafer

Total: 31 min
~ 98wafer/h Dry to Dry

APPLICATIONS

Cleaning

Polymere removal
Pre Diffusion Clean (DHF, SC1, SC2)
Wafer Reclaim
Post CMP Clean
Monitor Wafer Clean

Etch

Metal Etch (Al, Pt, Ti, TiW, Au, Cu,....)
Oxide Etch
Si-Etch
Freckle Etch

Resist Strip

Positive Resist
Negative Resist
SicOzone™ Resist Strip