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Process Laboratory


Laboratory Salzburg

Cleanroom Class <100

Process Qualification in Laboratory

 

Applications

  • Metal Etch (Al, Ti, Pt,…)
  • Oxide Etch
  • Metal Lift Off (MLO)
  • Clean
  • Strip
  • SicOzone™Strip/Clean
  • Wafer Thinning
  • Develop

Chemicals

  • Acids (HF, BOE, Al-Etch…)
  • Ozone (O3)
  • Solvents (EKC, NMP,…)

Substrates

  • Round <= 200mm
  • Squares <= 9”
  • Equipment
  • Single Wafer
  • Batch Spray

Test Capabilities

  • Particle Measurement
  • SEM Analysis
  • Wafer Thickness
  • Optical Microscope with Measurement Device