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Content:

Batch Spray Applications

Process Principle

  • Dry to Dry
  • Automated
  • Batch Spray

Advantages

  • Operator Safety
  • Equipment with Small Footprint
  • Low DI Water Consumption

Etch

Cleaning

Resist Strip (Acids, O3)

Resist Strip (Solvents)

Develop

 

 

 

Process Example

  • Load Wafer
  • Step 1: Metal Etch
  • Step 2: Di Water Rinse
  • Step 3: Freckle Etch
  • Step 4: Di Water Rinse
  • Step 5: Resist Strip
  • Step 6: Di Water Rinse
  • Step 7: Dry Wafer
  • more

CD Uniformities

  • Batch < 3%
  • Wafer < 3%


Link to Single Wafer Applications