Member of

 

 

 

 

 

 

 


Etch

Clean

Resist Strip

  • Metal Etch (Al, Cu, Ti, Au, Ni,...)
    with End Point Detection
  • III/V Etch (GaAs, AlGaAs, InGaP,...)
  • Oxide Etch
  • Freckle Etch
  • Silicon Etch
  • Ge Etch
  • Nitride Etch
  • Backside Etch
  • UBM Etch
  • Glass Etch
  • SicOzoneTM Strip
  • Positive and Negative Resist Strip
  • Implanted Photo Resist Strip
  • Enhanced Strip
  • Resist Rework

 

 

Clean

Resist Strip

Resist Develop

  • Polymer Clean
  • Etch Residue Clean
  • Post Ash Residue Clean
  • Positive Resist Strip
  • Negative Resist Strip
  • Metal Lift Off
  • Photoresist Developing

 

 

Etch

Clean

Resist Strip

  • Metal Etch (Al, Cu, Ti, Au, Ni,...)
    with End Point Detection
  • III/V Etch (GaAs, AlGaAs, InGaP,...)
  • Oxide Etch
  • Freckle Etch
  • Silicon Etch
  • Ge Etch
  • Nitride Etch
  • Backside Etch
  • UBM Etch
  • Glass Etch
  • SicOzoneTM Strip
  • Positive and Negative Resist Strip
  • Implanted Photo Resist Strip
  • Enhanced Strip
  • Resist Rework

Siconnex Process Laboratory

All applications are approved in the Siconnex own Process Laboratory in Salzburg, Austria.
Our BATCHSPRAY® systems are delivered with a proven recipe to ensure a smooth and fast start-up.
To achieve constant process innovation Siconnex puts a lot of effort into R&D.
Therefore we work together with various institutes, customers and chemical suppliers all over the world.